爱立信2012校园招聘火热进行中

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爱立信2012校园招聘火热进行中，全国各地数十个岗位开放投递。
' A" {" g5 F! g) ^, X6 ?还未申请爱立信2012校园招聘职位的同学，欢迎大家投递以下职位，或转发给感兴趣的同学。

  v. Y; ~( T) E如果您已经投递了其他职位又想改变志愿，请关注我们下一个调剂期的公告，在下一个调剂期转投以下职位

5 Z- n! E2 }; ]0 o7 s) i; q; }截至2011-11-1仍然在火爆热招的职位如下：
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全球服务执行中心
(以下全部职位均将在西安现场面试，后续还将在东北现场面试，欢迎全国各地同学投递）
) N# m; Q! S1 u6 o7 p8 ehttp://ericssoncampus.dajie.com/ericsson/joblist?type=1&areaId=19
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DL01 Core & Transpor Network Consultant
, i( ?8 o& J# e0 s% zDL02 Broadband Network Service Engineer
DL03 Integration Engineer
* L' Y% B7 |7 y% i; g, uDL04 Packet Core Network Support Engineer
+ z8 x3 S( d/ Y. I! @1 _2 RDL07 GSC Service engineer-GSM Radio Access Network
DL08 Core Network Servcie Engineer(Dalian)
% j2 I! @8 ^$ t* D. LDL09 IMS Service Engineer (IMS网络集成服务工程师)
DL10 LTE RAN System Integration Engineer
4 k  ~8 _; G6 E) eWH01 Radio Network Solution Consultant
WH02 Radio Access Network Support Engineer
WH04 WCDMA RAN System Integration Engineer
! r' r8 }6 l( ?3 Q) yWH05 LTE RAN System Integration Engineer
3 d* a; |3 E) q8 m$ q4 q& h9 tWH06 Service Engineer,Mobile Network Operation and Support System

% c  E2 t+ R8 p( \  c1 \7 z北京研发中心
$ l  Q6 u/ T# C8 b: S# XBJ16 RBS Performance Verification Engineer   即将去西安现场面试
BJ17 Environmental and Product Approval Verification  即将去西安现场面试
BJ25 Radio & Digital Design Engineer 即将去西安现场面试
3 b+ x6 o  x5 S7 ]* d& X6 n: SBJ26 Design Integration Engineer 即将去西安现场面试
BJ32 GPON BLM Software Design Engineer
$ f; R; k" p9 x8 n4 M. Q! x+ ZBJ34 Embedded Software Design Engineer
; ?4 `, {9 T3 w. @; k$ LBJ40 Component Engineer
. j: |. _; V: x- d5 N& r: LBJ46 OAM Software designer
# B/ ]7 Y. O. g7 x) o2 XBJ47 System Integration & Verification Engineer
BJ52  power design engineer
3 X  ^5 x9 Q. j7 u! k: x/ i3 SBJ55 RBS System Design Engineer
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# @, ]1 y% y! |- |! M0 [0 M广州研发中心
. n* @# [# t0 ?GZ07 Software Design Engineer
GZ08 Integration and Verification Engineer

1 {3 m9 v5 P3 I  H9 p4 n深圳研发中心
& P9 x+ E2 P2 a& f" G4 k3 dSZ04 R&D System Design Engineer
) F( T# ]" l% ?$ f# DSZ05 R&D Test Engineer (SIT Engineer)
SZ01 R&D Embedded Software Engineer
SZ02 R&D Embedded Platform Software Engineer
. a" H" [3 i7 eSZ03 R&D JAVA Software Engineer

南京研发中心
, z) {0 q. z& L) Y. G  R, fNJ07 R&D System I&V Engineer

服务交付运营中心(广州)
GZ04 Service Engineer
5 _; f9 g; n. {" G4 ?# v$ ]/ \GZ05 Service Engineer (Integration)
GZ06 Customer Support Engineer
GZ02 Multimedia & Application Software Design Engineer
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4 W' C* `9 P* O% H+ S" ~服务交付运营中心(北京)
BJ45 Tools Designer

/ P0 S7 L+ v) i& }服务交付运营中心(重庆)
CQ01 Assessed Integration Engineer
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[非技术类]  
3 n4 |+ i: g; X0 _# D, m财务部
  H$ v' U" [% z" M9 ]BJ50 T&E Accountant
BJ22 Accounts Receivable & Banking Accountant
$ |; Z- P7 X3 j- a' i$ mBJ23 Contact Center Specialist (English)
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& }2 L7 O) }# A人力资源部
1 @0 |3 r1 }1 W  KBJ51 HR Officer, HR Direct (Japanese Speaker)
0 X8 r7 G; z; s4 Y0 E- @6 RBJ50 HR Specialist - Learning and Development Support
  
6 y: F/ C- R% g投递上述“火爆热招”职位将有更多机会和更高的可能性获得面试机会。
& Z+ y$ h% {/ v' J& O" w; A也欢迎大家将此信息转发给同学或好友，感谢关注！祝您求职顺利！

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( F% T4 ]3 }; R9 s! A$ X+ N2011-11-1